| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971864 | Microelectronics Reliability | 2016 | 5 Pages |
Abstract
In this paper, the application of laser deprocessing technique is proposed to solve the bond pad over-etched issue. This proposed technique is a quick and reversal way in deprocessing technique for defect identification in PFA.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
H.H. Yap, P.K. Tan, L. Zhu, H. Feng, Y.Z. Zhao, R. He, H. Tan, B. Liu, Y.M. Huang, D.D. Wang, J. Lam, Z.H. Mai,