Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4971868 | Microelectronics Reliability | 2016 | 4 Pages |
Abstract
The AECQ-006 (Automotive Electronics Council Qualification Requirements for components using Cu wire) requires stitch pull tests on decapsulated Cu wire devices after TMCL and HAST/THB testing. The challenge is to perform decapsulation that exposes the complete interconnect without damaging the wires, leads or bondpads. A new method was developed in NXP to achieve this goal. An existing Cu wire decapsulation recipe was improved to protect the leads by adding Benzotriazole or AgNO3 to the nitric/sulphuric acid mixture.
Related Topics
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Computer Science
Hardware and Architecture
Authors
R. Stegink, Evan Liu, Manita Duangsang,