| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971872 | Microelectronics Reliability | 2016 | 10 Pages |
Abstract
In addition, the new metallization enables interconnects with copper bond wires, which yield, together with an improved die attach technology, a major improvement in the power cycling capability.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Frank Hille, Roman Roth, Carsten Schäffer, Holger Schulze, Nicolas Heuck, Daniel Bolowski, Karsten Guth, Alexander Ciliox, Karina Rott, Frank Umbach, Martin Kerber,