| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 542360 | Microelectronics Journal | 2009 | 5 Pages |
Abstract
Accurate knowledge of mechanical and thermal properties of structural materials used in MEMS is essential for optimum geometric and functional design. The extraction of precise physical properties is rather complicated due to the size effects, the complexity of the structures and the variations of formation processes. This work is intended to determine the thermal properties of silicon-nitride and diamond layers applied in thermal sensor structures by analysing thermal responses of a multilayer micro-heater structure.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
P. Csíkvári, P. Fürjes, Cs. Dücső, I. Bársony,