| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 542650 | Microelectronics Journal | 2007 | 4 Pages |
Abstract
New application of polyimide (PI) is introduced in this paper. PI film of 27 μm is achieved, and the excellent thermal-isolation performance of the film is simulated by ANSYS. The surface of film is flat, which is suitable for the fabrication of other materials such as aluminum and silicon nitride. The PI film is used as thermal-isolation layer of uncooled a-Si thin film transistor infrared sensors in this research, and the fabrication process is greatly simplified.
Keywords
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Xing-Ming Liu, Lin Han, Li-Tian Liu,