Article ID Journal Published Year Pages File Type
542695 Microelectronics Journal 2006 7 Pages PDF
Abstract

Boiling heat transfer from hybrid micro-nano structured thermal interfaces has been studied experimentally using PF5060 and deionized water as working fluids for the range of saturation temperatures Tsat between 35 °C and 60 °C. Various enhancement structures were fabricated using surface micromachining in silicon. The performance of the smooth and roughened silicon surfaces, bare and fully coated with carbon nanotubes (CNTs), the silicon-etched as well as CNTs-based pin-fin arrays, and the 3D microstructures have been studied in detail. The highest heat fluxes were obtained using the 3D microstructure without CNTs—these are 27 and 130 W/cm2 for PF5060 and water, respectively. Experimental results indicate that use of the CNT-enabled, purely nano-structured interfaces appear to improve boiling heat transfer only at very low superheats, as compared to the smooth surfaces.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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