Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
542714 | Microelectronics Journal | 2006 | 5 Pages |
Abstract
The present investigation introduces convex corners undercutting and results of rhombus compensation patterns in 40% aqueous KOH solution and in KOH saturated with isopropanol (IPA) solution. All experiments are carried out on (1 1 0) silicon at 70 °C. Undercuts take place on convex corners in both solutions. Moreover, the front etch planes governing undercut vary with solutions. Rhombus compensations are used to correct the undercut. Perfect acute corner without residue is obtained, and there are only some residue structures on both sides of obtuse convex corners in KOH with IPA solution, which are better results than those in pure aqueous KOH solution.
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Authors
Cuiping Jia, Wei Dong, Caixia Liu, Xindong Zhang, Jingran Zhou, Zhicheng Zhong, Hailin Xue, Huidong Zang, Baokun Xu, Weiyou Chen,