Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
542783 | Microelectronics Journal | 2006 | 8 Pages |
Abstract
This paper deals with the evaluation of a substrate-thinning technique as a way to control the substrate current issues. A test structure has been realized on a Smart Power Technology. Comprehension of the phenomena has been validated thanks to TCAD simulation. This technique was then applied to a commercial IC and the authors show that they succeeded to reduce by one decade the collected current on a victim, although the IC has already been optimized with classical solutions.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
C. Lochot, J.P. Lainé, M. Bafleur, A. Cazarré, J. Tasselli,