| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 544790 | Microelectronics Reliability | 2015 | 7 Pages |
•Temperature accelerated steady state life test.•X-band multifunction chip for active phased array radars.•Thermal analysis using a finite element model.•Failure rate based on the HTOL.
A 1000-h steady state life test at a temperature of 125 °C was performed on ten X-band MMIC multifunction chips for use in active phase array radar systems. Internal switches, phase shifters, and attenuators were operated through an integrated serial-to-parallel converter under the five-second stepped external control signal for the life test period. None of the ten samples failed under the failure criteria based on the JEP118 standard. The calculated failure rate using the Chi Square Statistic was 1.6 e−6 failures/h for the 90% confidence level. Maximum DC current variation was +16% for an initial value. Maximum variations of small signal gain, phase shift, and attenuation were 0.96 dB, 2°, and 0.17 dB, respectively, over a frequency range of 8.5–10.5 GHz.
