| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545152 | Microelectronics Reliability | 2011 | 7 Pages |
The mechanical and wetting properties of the diglycidyl ethers of bisphenol A (DGEBA) and bisphenol F (DGEBF) with epoxy-terminated siloxane oligomers (ETSO) were investigated to examine their durabilities as anisotropic conductive adhesive (ACA) resins. The mechanical properties were improved by decreasing the ETSO content due to the high cross-linking density resulting from the short-chain length of ETSO–diaminodiphenylmethane (DDM). To obtain good wettability in both systems, a short-chain reductant (butanoic acid, BA) was added. DGEBF produced enhancement in the wetting angle compared to that of DGEBA due to its low viscosity. DGEBF can be considered an eco-friendly material in this process since it does not require the use of other chemicals, such as a diluent. Therefore, DGEBF/ETSO–DDM with reductant constitutes a suitable system for favorable environmental processing.
Graphical abstractWetting angles of Sn/Bi solder (a) DGEBA/ETSO-DDM witout reductant, (b) DGEBA/ETSO-DDM with reductant, (c) DGEBF/ETSO-DDM without reductant, (d) DGEBF/ETSO-DDM with reductant.Figure optionsDownload full-size imageDownload as PowerPoint slideResearch highlights► Flexibility increased by increasing of siloxane oligomer contents. ► The tensile and flexural properties of the DGEBA/ETSO-DDM show higher than DGEBF. ► Low viscous DGEBF based epoxy resin gave better reduction capability than DGEBA.
