Article ID Journal Published Year Pages File Type
545185 Microelectronics Reliability 2010 4 Pages PDF
Abstract

Generally it is known that NBTI degradation increases with decrease of a channel width in p-MOSFETs but hot carrier degradation decreases. In this work, a guideline for the optimum fin width in p-MuGFETs is suggested with consideration of NBTI and hot carrier degradation. Using the device lifetime defined as the stress time necessary to reach ΔVTH = 10 mV, the optimum fin widths have been extracted for different stress voltages and temperatures. When a fin width is narrower than the optimum fin width, the device lifetime is governed by the NBTI degradation. However, when fin width is wider than the optimum fin width, the device lifetime is dominantly governed by hot carrier degradation. The optimum fin width decreases with the increase of the stress voltage but it increases with the increase of the stress temperature.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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