| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545193 | Microelectronics Reliability | 2010 | 4 Pages |
Abstract
The behaviour of Ni in Sn under a thermal gradient driving forces was calculated considering boundary conditions typical of lead-free solder applications. The steady state concentration profiles for a fast diffuser were determined and the consequences for reliability discussed.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
J.R. Lloyd, N.A. Connelly, Xiaoli He, K.J. Ryan, B.H. Wood,