Dynamic lock-in thermography for operation mode-dependent thermally active fault localization

Microscopic Lock-In Thermography (LIT) has proven unsurpassed capability for non-destructive localization of thermally active defects like shorts or resistive opens, even through the full package. This paper briefly reviews the real-time pixel-wise lock-in methodology, as the key to the extreme temperature sensitivity. A typical LIT work-flow is demonstrated whereby the main focus of the paper is to discuss and demonstrate different ways how to activate the thermally active defects with more complex DUTs/defect signatures, requiring ATE docking.