| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545213 | Microelectronics Reliability | 2010 | 5 Pages |
Abstract
Thermally induced stress is determined using boundary values obtained by complementary Scanning Joule Expansion Microscopy and Scanning Thermal Microscopy. The stress function is then solved with the Finite Element Method. Surface stress analysis as well as stress analysis of multilayered structures are performed in order to demonstrate the application of the developed measurement technique to reliability investigations.
Related Topics
Physical Sciences and Engineering
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Hardware and Architecture
Authors
M. Fakhri, A.-K. Geinzer, R. Heiderhoff, L.J. Balk,