Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
545505 | Microelectronics Reliability | 2009 | 5 Pages |
Abstract
In this work, the degradation of GaN-based packaged white light-emitting diodes (LEDs) caused by accelerated humidity testing will be investigated using non-destructive failure analysis tools, namely the mixed statistical distribution, spectrum analysis and parameters extraction. Physical failure analysis techniques are then used to verify and conclude the deduced failure mechanisms obtained by the non-destructive failure analysis tools.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Cher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu,