Article ID Journal Published Year Pages File Type
545505 Microelectronics Reliability 2009 5 Pages PDF
Abstract

In this work, the degradation of GaN-based packaged white light-emitting diodes (LEDs) caused by accelerated humidity testing will be investigated using non-destructive failure analysis tools, namely the mixed statistical distribution, spectrum analysis and parameters extraction. Physical failure analysis techniques are then used to verify and conclude the deduced failure mechanisms obtained by the non-destructive failure analysis tools.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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