| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545515 | Microelectronics Reliability | 2009 | 5 Pages |
Abstract
A multiscale simulation methodology is presented to predict the macroscopic mechanical properties of aluminum thin films with a columnar grain structure from the morphology at microscopic scale. The elasto–plastic characteristics of the thin films are calculated as a function of the grain size, temperature, and strain rate by taking into account creep phenomena. The simulated data are validated by experimental stress–strain curves measured by dedicated microstructures in conjunction with a nanoindentation test equipment.
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Authors
Haruka Kubo, Mauro Ciappa, Takayuki Masunaga, Wolfgang Fichtner,