| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545517 | Microelectronics Reliability | 2009 | 5 Pages |
Abstract
In case of operation distance degradation, frequently RFID chips are extracted from their tags and electrically/physically analysed. However, manifold mechanisms based on interaction effects between package and device, exist. This paper examines and highlights these mechanisms, giving also valuable hints for the failure analyst.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Peter Jacob, Willy Knecht, Albert Kunz, Giovanni Nicoletti, Thomas Lautenschlager, Moreno Mondada, Damien Pachoud,