| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545764 | Microelectronics Reliability | 2008 | 7 Pages |
Abstract
This paper presents a fundamental assessment of pressure-induced tin whisker formation. A creep-based tin whisker model was developed to explain experimental data as well as data from industrial studies. A grain boundary diffusion model was then developed to predict a maximum whisker length. It is shown that creep properties obtained from samples can be used to screen plating finishes susceptible to tin whiskering. This enables a manufacturer to assess tin whisker risks prior to volume production.
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Authors
Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Michael G. Pecht,