Silicon based system in package: Improvement of passive integration process to avoid TBMS failure

Because of its large dimension and its high level of integration, the PICS (Passive Integration Connecting Substrate) developed by NXP prone to top to bottom metal short (TBMS) failure during temperature cycling test. Several options of process modifications as well as new design rules and stress relief patterns for preventing TBMS failure are described. These countermeasures have been evaluated under high thermo-mechanical stress test. The results of these evaluations are also presented in this paper.