Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
545837 | Microelectronics Reliability | 2008 | 5 Pages |
Abstract
In the transfer of a BCD-process, large differences in width scaling were found in ESD protection structures. Investigation showed that the presence of a ΔVthΔVth-implant was the root cause for the non-linear relationship between device width and soft fail current. The devices also showed large differences in leakage currents. In this paper an explanation is given for both phenomena: from a theoretical point of view and based on TCAD simulations.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
E.H.T. Olthof, G.J. de Raad,