Article ID Journal Published Year Pages File Type
545837 Microelectronics Reliability 2008 5 Pages PDF
Abstract

In the transfer of a BCD-process, large differences in width scaling were found in ESD protection structures. Investigation showed that the presence of a ΔVthΔVth-implant was the root cause for the non-linear relationship between device width and soft fail current. The devices also showed large differences in leakage currents. In this paper an explanation is given for both phenomena: from a theoretical point of view and based on TCAD simulations.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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