| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 545837 | Microelectronics Reliability | 2008 | 5 Pages | 
Abstract
												In the transfer of a BCD-process, large differences in width scaling were found in ESD protection structures. Investigation showed that the presence of a ΔVthΔVth-implant was the root cause for the non-linear relationship between device width and soft fail current. The devices also showed large differences in leakage currents. In this paper an explanation is given for both phenomena: from a theoretical point of view and based on TCAD simulations.
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											Authors
												E.H.T. Olthof, G.J. de Raad, 
											