Article ID Journal Published Year Pages File Type
545838 Microelectronics Reliability 2008 5 Pages PDF
Abstract

This work presents some results from electrical (TDDB, TLP, HBM and MM) measurements and ESD calculations/simulations on passive components such as capacitors. In a SIP context, the ESD sensitivity of innovative 3D capacitors is studied. A method to predict the failure threshold of a wide range of capacitor values under ESD events is presented and validated by measurement on silicon. This method consists of using the basic equation of the charge conservation for capacitors in parallel that is adapted to the model of the ESD event.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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