| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545847 | Microelectronics Reliability | 2008 | 4 Pages |
Abstract
This paper presents a methodology and tool based on 3D electro-thermal finite elements modeling intended to analyze the sequence of the events after emergence of defects in automotive power MOSFETs. Finite element modeling of power device and its nearby environment is detailed. The effects of delamination and bonding wire lift off on device transient electro-thermal behavior are investigated during a short circuit mode. Thus it helps to quantify the electro-thermal impact of the damages. Such modeling is useful for optimization of structure design to guarantee a longer lifespan.
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Authors
J.B. Sauveplane, P. Tounsi, E. Scheid, A. Deram,