| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545850 | Microelectronics Reliability | 2008 | 6 Pages |
Abstract
For the first time the thermal resistance (Rth) of Multi-Trenched (MT) power devices is evaluated and compared with their Deep Trench Isolation flanked (DTI-flanked) and bulk counterparts. The Rth extraction is carried out by adapted test structures based on the four-point heater/sensor method. Additional TCAD simulation supports the experimental stationary values and proves that dynamic heating can limit the MT power devices energy capability.
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Physical Sciences and Engineering
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Authors
J. Roig, B. Desoete, F. Bauwens, F. Lovadina, P. Moens,