| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 545885 | Microelectronics Reliability | 2008 | 6 Pages |
Abstract
A new thick film photoimageable silver paste of improved properties has been elaborated. The paste is less sensitive to the visible light. Certain disadvantages of most commercially available materials, such as necessity of operating with the paste in the room illuminating with yellow, green or red light has been eliminated. Further improvement of conductive silver pastes to enable reducing lines width down to 10 μm has been done.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Małgorzata Jakubowska, Selim Achmatowicz, Valentinas Baltrušaitis, Anna Młożniak, Iwona Wyżkiewicz, Elżbieta Zwierkowska,