Article ID Journal Published Year Pages File Type
545889 Microelectronics Reliability 2008 5 Pages PDF
Abstract

Low-frequency noise spectroscopy is used to examine the interactions between resistive and conductive films that take place during thick-film resistor (TFR) fabrication. Two noise parameters are introduced to quantitatively describe the strength of these interactions. They refer to intensity and repeatability of the noise generated in the resistor interfaces. Extensive experimental studies performed on ruthenium dioxide and bismuth ruthenate TFRs terminated with gold, platinum–gold, palladium–silver and platinum–silver contacts from various manufacturers allow to establish criteria of pastes compatibility and to evaluate compatible systems of pastes for standard “on-alumina” and low-temperature co-fired ceramic (LTCC) resistors. It is found that gold contacts form low-size-effect, stable, low-noise interfaces both with ruthenium dioxide and bismuth ruthenate TFRs. Silver-containing terminations can be used with bismuth ruthenate but not with ruthenium dioxide resistors. Manufacturer optimized system of pastes for LTCC technology works best when used to produce high-resistive, co-fired devices.

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