| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 545936 | Microelectronics Reliability | 2008 | 12 Pages | 
Abstract
												This paper reviews the possible causes and effects for no-fault-found observations and intermittent failures in electronic products and summarizes them into cause and effect diagrams. Several types of intermittent hardware failures of electronic assemblies are investigated, and their characteristics and mechanisms are explored. One solder joint intermittent failure case study is presented. The paper then discusses when no-fault-found observations should be considered as failures. Guidelines for assessment of intermittent failures are then provided in the discussion and conclusions.
Related Topics
												
													Physical Sciences and Engineering
													Computer Science
													Hardware and Architecture
												
											Authors
												Haiyu Qi, Sanka Ganesan, Michael Pecht, 
											