Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
545958 | Microelectronics Reliability | 2007 | 10 Pages |
Abstract
Various conventional and novel electrical characterization techniques have been combined with careful, robust analysis to properly evaluate high-κ gate dielectric stack structures. These measurement methodologies and analysis techniques have enhanced the ability to separate pre-existing defects that serve as fast transient charging and discharging sites from defects generated with stress. In addition, the differentiation of electrically active bulk high-κ traps, silicon substrate interface traps, and interfacial layer traps has been effectively demonstrated.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Chadwin D. Young, Dawei Heh, Arnost Neugroschel, Rino Choi, Byoung Hun Lee, Gennadi Bersuker,