Article ID Journal Published Year Pages File Type
545960 Microelectronics Reliability 2007 4 Pages PDF
Abstract

Dielectric breakdown and trapping effects are of serious concern for high-k dielectrics. In this paper acceleration models for dielectric breakdown and leakage current degradation in HfSiO films thicker 10 nm are introduced and the mechanism for leakage current increase during constant voltage stress is evaluated.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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