Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
545960 | Microelectronics Reliability | 2007 | 4 Pages |
Abstract
Dielectric breakdown and trapping effects are of serious concern for high-k dielectrics. In this paper acceleration models for dielectric breakdown and leakage current degradation in HfSiO films thicker 10 nm are introduced and the mechanism for leakage current increase during constant voltage stress is evaluated.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
R. Duschl, M. Kerber, A. Avellan, S. Jakschik, U. Schroeder, S. Kudelka,