| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 546112 | Microelectronics Reliability | 2006 | 6 Pages |
Abstract
This paper presents a recent study by monitoring input power in wire bonding process on its performance. The instantaneous driving voltage and current to the PZT/transducer system were recorded and the input power histories for all tests were analyzed. A stable and satisfied bonding can be obtained at moderate ultrasonic power setting. A laser Doppler vibrometer was used to record the response of the structure. The initial power oscillating may represent the phase locking chaos, and the final attenuation may reflect the remains of kinetic energy in the structure. Strength of wire bonding should be attributed to the input power during the main loading segment.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Lei Han, Fuliang Wang, Wenhu Xu, Jue Zhong,