Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
546190 | Microelectronics Reliability | 2006 | 7 Pages |
This article presents a reliability assessment of aeronautic electronic board using the accelerated test approach. The mission profile used is one defined in FIDES for electronic equipment in aircraft. The reliability function is defined taking into account the different phases of product life (Ground, Taxiing, Flying, Dormant). FIDES describes the environment (thermal and humidity, thermal cycling, mechanical, …) for each phase. The paper presents the different accelerated life models used to take into account all environment. A test plan is proposed to estimate the unknown parameters of accelerated life models. The thermal and humidity and thermal cycling tests have been performed and the data are analyzed. Finally, the reliability function is evaluated.