Numerical evaluation of miniaturized resistive probe for quantitative thermal near-field microscopy of thermal conductivity

Modern applications of source characteristic based quantitative thermal microscopy in the nanometer regime require optimized probe characteristics with respect to both, geometry and electrical / thermal dynamic source behaviour. Within this field of dynamic techniques completely different approaches are available. Exemplarily for these different approaches the capability of a special resistive thermal probe will be investigated by means of transient 3D thermal electrical coupled Finite Element Analysis (FEA) within this work.