Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
546216 | Microelectronics Reliability | 2006 | 5 Pages |
Abstract
The progressive wear-out of a breakdown path in ultra-thin gate oxides depends on oxide thickness and follows the intrinsic voltage acceleration model of time to breakdown. The quantification of progressive wear-out in this work is the critical step towards product relevant assessment of ultra-thin gate oxides.
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