Article ID Journal Published Year Pages File Type
546248 Microelectronics Reliability 2006 6 Pages PDF
Abstract

A novel technique is presented, which uses dIce/dt and the transconductance as a thermo-sensitive parameter for the measurement of the static and of the transient average junction temperature in IGBT devices. The paper describes the physics of the signal generation, provides the experimental setup, and discusses the accuracy and the suitability of the technique under operating conditions of the devices.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture