Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
546275 | Microelectronics Reliability | 2006 | 4 Pages |
Abstract
Assembly technologies follow the reduction in size of circuit board components and correlatively the number of active layers increases significantly. Therefore, during a conventional acoustic analysis, the obtained image becomes more and more complicated to analyze. In a previous paper, we focused our research on a method for a suitable visualization of the timescale of an acoustic signal (CWT). In this paper we present the use of the non-destructive control for the study of a 3D package submitted to accelerated ageing tests using harsh conditions.
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