Major factors to the solder joint strength of ENIG layer in FC BGA package

Since electroless nickel and immersion gold (ENIG) process was implemented as the surface finish of printed circuit board (PCB) substrate, there have been lots of reports on the brittle fracture between the Ni–P (phosphorous) layer and solder which results in the poor solder joint strength performance. Galvanic corrosion during immersion Au plating process and P-content in Ni–P layer were considered as major factors in the solder joint strength of ENIG layer in this investigation. The attempt to reduce the galvanic corrosion attack in Ni–P layer was made by changing immersion Au plating process to partial electroless Au plating process. Reducing the galvanic corrosion attack was proved to be effective to improve the solder joint strength of ENIG layer. Evaluation of the solder joint performances in variation with the thickness of the Ni layer leads to the conclusion that the thicker Ni layer has the better solder joint strength performances. The result also showed that higher P-content in Ni layer is more favorable to the solder joint strength.