Article ID Journal Published Year Pages File Type
546473 Microelectronics Journal 2008 7 Pages PDF
Abstract

An investigation is conducted to assess the thermal performance of multi-layered screen laminates when used as porous extended surface matrices (ESMs) in vertical up flow boiling. A dielectric coolant (FC-72) is used as the working fluid. Four specimens are constructed having different mesh-geometries and/or number of layers. Channel Reynolds numbers are varied from 2700 to 8500 and ESM base superheats are varied from 0 to 40 °C.Results indicate that devices equipped with this technology can tolerate steady heat fluxes in excess of 100 W/cm2 (based on the base cross section area of the ESM) with corresponding ESM base superheats below 30 °C. Thermal performance (the increase in heat flux at a given superheat) increases by as much as 30% for a 3-fold increase in Reynolds number. The total capacity of the ESM (the product of heat flux and base cross section area) increases approximately linearly with ESM thickness. A feature of this technology is that it greatly extends the heat flux working range over an unenhanced surface.

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