Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
546944 | Microelectronics Journal | 2015 | 9 Pages |
Abstract
A novel approach for constructing multi-port dynamic compact thermal models of nonlinear heat diffusion in electronic components is presented, extending a technique previously conceived for the one-port case. The approach allows achieving high levels of accuracy even for small state–space dimensions of the model. It is also very efficient since it requires the solutions to a few linear heat diffusion problems in the frequency domain. The multi-port compact models exhibit structure similar to the one-port counterparts and can be used to accurately approximate not only the junction temperatures, but also the whole space–time temperature distribution within the electronic components.
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Lorenzo Codecasa, Vincenzo d׳Alessandro, Alessandro Magnani, Niccolò Rinaldi,