| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 546999 | Microelectronics Reliability | 2012 | 8 Pages |
Abstract
The paper first describes challenges that engineers face in predicting the reliability of microelectronic assemblies. In addition, the constraints such as temperature, temperature cycle or moisture may interact with each other. So it is not feasible to solve the reliability problems without a methodological approach. The paper presents also case studies to illustrate a methodology combining experiments and simulations.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
H. Frémont, G. Duchamp, A. Gracia, F. Verdier,