Article ID Journal Published Year Pages File Type
547161 Microelectronics Journal 2014 5 Pages PDF
Abstract

•We describe the process fabrication of a planar interleaved micro-transformer.•Use of a magnetic material as core.•Substitution of the classical wire bonding by a bridge.•Low and high frequency characterization of the planar interleaved micro-transformer.

This paper presents the design, the fabrication and the characterization of a planar interleaved micro-transformer with an Yttrium Iron Garnet (YIG) core. The design of this micro-transformer and the manufacturing steps are presented. HFSS software is used for the conception and the simulation of the interleaved magnetic micro-transformer. It is composed of two identical windings. A bottom magnetic core is used to improve the integrated transformer performances. To form the windings, we have used a surface micromachining process. We have also used a negative photoresist (SU-8) as an insulating layer and as support for the fabrication of a bridge to connect the central end of the coils to the ground shield. The micro-transformer have been characterized with impedance meter up to 100 MHz, and completed to 1 GHz using vector network analyzer.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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