| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 547229 | Microelectronics Reliability | 2012 | 9 Pages |
Abstract
Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classification of Cu bonding, bonding mechanisms, process developments, its microstructure evolution, as well as other characterizations are reviewed. Researches about patterned Cu bonding, future prospects, and 3D integration using Cu bonding are discussed in this paper.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen,