| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 547402 | Microelectronics Reliability | 2011 | 5 Pages |
In this study, the SiGe epilayers were created on silicon substrate by using ultra-high vacuum chemical vapor deposition (UHV/CVD) and followed by annealing procedures. The frictional behaviors of SiGe epilayers were subjected to nanoscratch techniques under a ramping load.Damage caused by scratching was examined by atomic force microscopy (AFM); the results showed that the pile-up phenomena were significant on both sides of the scratch in the case of SiGe epilayers, suggesting that the dynamic deformation behavior was dominated by cracking as ploughing occurred during scratching. In addition, the SiGe epilayers films with different annealed conditions exhibited the decrease in coefficient of friction (COF), indicating the higher shear resistance exist in annealed SiGe epilayers, which probably affect the film uniformity and device yield under IC process integration.
► We evaluate the frictional behaviors of SiGe epilayers. ► We carried out higher shear resistance exist in annealed SiGe epilayers. ► The dynamic deformation affect the device yield under IC process integration.
