Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
547412 | Microelectronics Reliability | 2011 | 8 Pages |
Abstract
This paper presents an application of the peridynamic theory to predict crack paths in multilayer thin-film structures of electronic packages. The peridynamic theory is a nonlocal continuum theory that has an inherent crack initiation and growth criterion. Specifically, the peridynamic theory is employed to model cross-sectional nanoindentation, an experimental technique used for characterizing interfacial adhesion and observing crack paths. Cross-sectional indentation experiments previously conducted on blanket and patterned thin-film structures were simulated. The predicted crack propagation paths in both blanket and patterned multilayer thin-film structures compare well with the results from cross-sectional nanoindentation experiments.
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Authors
A. Agwai, I. Guven, E. Madenci,