Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
547516 | Microelectronics Reliability | 2007 | 6 Pages |
Abstract
To develop reliable integrated power electronics, it is paramount to consider the coupling between electrical, thermal and mechanical effects. Though essential for final validation, experimental analysis is time-consuming, especially when trying out new designs. Simulative approaches at multi-domain physical analysis need to be improved. In this work, a platform is proposed, in which all physics are treated with dedicated simulation programmes, co-ordinated by a custom-developed core section. A case study, based on a novel integrated power switch developed for railway traction applications, demonstrates the validity of the envisaged solution for virtual reliability assessment.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
P. Solomalala, J. Saiz, M. Mermet-Guyennet, A. Castellazzi, M. Ciappa, X. Chauffleur, J.P. Fradin,