| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 547581 | Microelectronics Reliability | 2007 | 5 Pages |
Abstract
The purpose is to create a new qualification methodology for plastic encapsulated electronic components used in an automotive environment at high temperature. It is based on the acceleration of failure mechanisms like ball bond lift (due to intermetallic Au–Al thickness growth), by combination of environmental stresses. The delamination measurement was used as an indicator of potential assembly weaknesses. An optimized package sequential qualification test flow is proposed.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
M.A. Bahi, P. Lecuyer, H. Fremont, J-P. Landesman,