Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
547582 | Microelectronics Reliability | 2007 | 5 Pages |
Abstract
In this paper we determined the water uptake of a die attach and a molding compound. The two types of polymer which were selected are a die attach filled with silver particles and an epoxy molding compound filled with silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibrium of test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Xiaosong Ma, K.M.B. Jansen, L.J. Ernst, W.D. van Driel, O. van der Sluis, G.Q. Zhang,