Article ID Journal Published Year Pages File Type
547584 Microelectronics Reliability 2007 5 Pages PDF
Abstract

In this work, we present a novel 3D electro-thermal simulation tool capable of taking into account also particular driving strategies of the electron device, as it may be the case of smart power MOSFETs where a control logic interacts with the power section and controls its dissipated power and temperature. As an example, a thermal shutdown circuit, capable of reading the temperature on chip and switching the device off if the latter reaches dangerous values, usually embedded within smart power devices used in automotive applications to drive direction light or small motors/actuators, is simulated to validate our approach.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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