Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
547600 | Microelectronics Reliability | 2007 | 6 Pages |
Abstract
In this work, temperature inhomogeneities inside IGBT modules are measured to assess their relevance for the component reliability. Such issue has not been considered in many previous studies, since it is often assumed that the electro-thermal characteristics of IGBTs compensate for such temperature differences. Starting from real temperature measurements, this work discusses such aspect aided by electro-thermal simulations. This method provides useful information for the reliable thermal design of power modules, also considering the actual cooling system.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
X. Perpiñà, A. Castellazzi, M. Piton, M. Mermet-Guyennet, J. Millán,