Article ID Journal Published Year Pages File Type
547615 Microelectronics Journal 2012 9 Pages PDF
Abstract

Process variations significantly impact leakage power, a pivotal parameter in designing a power grid. Because of the strong relationship between temperature and leakage power, the variations also impose statistical behavior on the operating temperature. In addition, the metal resistivity of a power grid increases with temperature. Therefore, ignoring the interdependency between leakage and temperature can introduce large errors in the power grid design. In this paper, a power grid analysis is proposed considering a statistical thermal profile across the grid. In addition, an efficient verification method is provided that ensures the robustness of the power grid in the presence of variations. A reliable estimation of the statistical thermal profile at the architecture level makes it possible to address any voltage violation early in the design process.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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