Article ID Journal Published Year Pages File Type
547670 Microelectronics Reliability 2007 8 Pages PDF
Abstract

This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of a RF module for automotive application. Combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making enabled design ranking and revealed two MCM-L/D and MCM-D designs with wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.

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Physical Sciences and Engineering Computer Science Hardware and Architecture
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