Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
547670 | Microelectronics Reliability | 2007 | 8 Pages |
This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of a RF module for automotive application. Combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making enabled design ranking and revealed two MCM-L/D and MCM-D designs with wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.