| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 547718 | Microelectronics Reliability | 2006 | 7 Pages |
Abstract
The three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Baozhen Li, Emmanuel Yashchin, Cathryn Christiansen, Jason Gill, Ronald Filippi, Timothy Sullivan,